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World's smallest programmable oscillator in tiny 1508 chip-scale package, consumes only 1.2 mm2 board space
工厂可编程降至1 Hz
- 与固定的32.768 kHz Xtal相比,显着降低功率
Smallest footprint in chip-scale (CSP): 1.5 x 0.8 mm
- 与2012年SMD相比,将板坯节省高达80%
小型SMD包:2.0 x 1.2 mm(2012)
- PIN兼容2012年XTAL SMD
纳米obower:900 na(典型值)
- 延长电池寿命
Operates down to 1.2 V
- Supports coin-cell or supercap battery backup
NanoDrive™减少了振荡振荡器输出
- 直接接口MCU / PMIC /芯片组XTAL
- 可编程输出摆幅最小化电源
- 振荡器输出消除了负载电容
No load or VDD filtering capacitors
- Eliminates any external capacitors
- Eliminates any external capacitors
- Eliminates load dependent startup issues
<100 ppm frequency stability over -40 °C to +85 °C temp. range
- 2 x和石英相比更好的稳定性
- 提高无线连接和RTC精度
- Wireless mouse
- Wireless keypads
- Pulse-per-second (PPS) timekeeping
- RTC参考时钟
- 电池管理计时
Document Name | 类型 |
---|---|
4L-QFN Package Composition Report (SiT1533, SiT1534, SiT1630) | 组成报告 |
WLCSP Package Composition Report (SiT15XX, SiT8021) | 组成报告 |
电子行业公民联盟模板 | Other Quality Documents |
SINTIME产品的制造票据 | Other Quality Documents |
环境冲突金属宣言 | Other Quality Documents |
环境政策环境政策 | Other Quality Documents |
sitWarranty on Date Code | Other Quality Documents |
ISO9001:2015注册证书 | Other Quality Documents |
Conflict Minerals Reporting Template | Other Quality Documents |
sitOscillator Reliability Report (0.18 micron CMOS process products) | 可靠性报告 |
SIT1532,SIT1534 CSP产品资格报告 | 可靠性报告 |
SiT153X, SiT1552, SiT163X Product Qualification Report | 可靠性报告 |
4L-QFN封装资格报告 - 汽车 | 可靠性报告 |
TSMC晶圆SGS报告 | RoHS/Reach/Green Certificates |
塔爵士晶圆SGS报告 | RoHS/Reach/Green Certificates |
4L / 6L-QFN封装均质材料和SGS报告 | RoHS/Reach/Green Certificates |
博世晶圆SGS报告 | RoHS/Reach/Green Certificates |
WLCSP Package Homogeneous Materials and SGS Report | RoHS/Reach/Green Certificates |
环境合规声明 | RoHS/Reach/Green Certificates |
Certificate of Compliance-EU RoHS Declaration | RoHS/Reach/Green Certificates |
评估板(Contact SiTime)–SIT6098(1508)| SiT6096 (2012)
可靠性计算器–Get FIT/MTBF data for various operating conditions
SMD 2012 4-Pins|CSP 1508 4-PINS– Preview packages withQFN3D步骤模型