世界上最小的TCXO在微小的1508芯片规模封装,低抖动,只消耗1.2平方毫米的板空间
芯片规模最小(CSP)
- 1.5 x 0.8毫米:节省电路板空间
超低功率:4.5μA(典型值)
- Maximizes battery life
低抖动2.5 NS RMS集成阶段抖动(IPJ)
- 适用于音频应用
Internal VDD supply filtering
- 消除外部VDD旁路电容,保持超小型占地面积
Drives multiple loads
- Eliminates multiple discrete XTALs + load caps
- Smartwatch
- 健康和健康监视器
- 智能电表(AMR)
- 数据记录器
- Power & energy
- 零售电子产品
- 长途通信
- 机对机(M2M)
- Smartphone
- 健身跟踪器
- 数据连接
- 平板电脑
Document Name | 类型 |
---|---|
WLCSP包组合报告(SIT156X,SIT1576) | 组成报告 |
电子行业公民联盟模板 | Other Quality Documents |
SINTIME产品的制造票据 | Other Quality Documents |
环境冲突金属宣言 | Other Quality Documents |
SiTime环境政策 | Other Quality Documents |
sitWarranty on Date Code | Other Quality Documents |
ISO9001:2015注册证书 | Other Quality Documents |
Conflict Minerals Reporting Template | Other Quality Documents |
sitOscillator Reliability Report (0.18 micron CMOS process products) | 可靠性报告 |
坐156X, SiT1576 Product Qualification Report | 可靠性报告 |
TSMC晶圆SGS报告 | RoHS/Reach/Green Certificates |
塔爵士晶圆SGS报告 | RoHS/Reach/Green Certificates |
博世晶圆SGS报告 | RoHS/Reach/Green Certificates |
WLCSP Package Homogeneous Materials and SGS Report | RoHS/Reach/Green Certificates |
环境合规声明 | RoHS/Reach/Green Certificates |
Certificate of Compliance-EU RoHS Declaration | RoHS/Reach/Green Certificates |
SIT6098(1508)评估板用户手册– Evaluate oscillator performance
可靠性计算器–Get FIT/MTBF data for various operating conditions
CSP 1508 4针三维台阶模型– Preview oscillator packages in 3D