World's smallest TCXO in tiny 1508 chip-scale package, low-jitter, consumes only 1.2 mm2 board space
Smallest footprint in chip-scale (CSP)
- 1.5 x 0.8 mm: Saves board space
Ultra-low power: 4.5 µA (typ)
- 最大限度地提高电池寿命
Low jitter 2.5 ns RMS Integrated Phase Jitter (IPJ)
- Suitable for audio applications
内部VDD电源过滤
- Eliminates external VDD bypass capacitor to maintain ultra-small footprint
驱动多个载荷
- 消除多个离散Xtals +负载帽
- 智能手表
- Health and wellness monitors
- Smart meters (AMR)
- Data loggers
- 电力与能量
- Retail electronics
- Long-range communications
- Machine to machine (M2M)
- Smartphone
- Fitness tracker
- Data connectivity
- 片剂
文档名称 | Type |
---|---|
WLCSP Package Composition Reports (SiT156X, SiT1576) | Composition Reports |
Electronics Industry Citizen Coalition Template | 其他优质文件 |
Manufacturing Notes for SiTime Products | 其他优质文件 |
sitConflict Metal Declaration | 其他优质文件 |
sitEnvironmental Policy | 其他优质文件 |
日期代码的境内保修 | 其他优质文件 |
ISO9001:2015 Certificate of Registration | 其他优质文件 |
冲突矿物报告模板 | 其他优质文件 |
距离振荡器可靠性报告(0.18微米CMOS工艺产品) | Reliability Reports |
SIT156X,SIT1576产品资格报告 | Reliability Reports |
TSMC Wafer SGS Report | RoHS / REACH / Green证书 |
Tower Jazz Wafer SGS Report | RoHS / REACH / Green证书 |
BOSCH Wafer SGS Report | RoHS / REACH / Green证书 |
WLCSP封装均质材料和SGS报告 | RoHS / REACH / Green证书 |
sitEnvironmental Compliance Declaration | RoHS / REACH / Green证书 |
合规证书 - 欧盟RoHS宣言 | RoHS / REACH / Green证书 |
SiT6098 (1508) Evaluation Board User Manual- 评估振荡器性能
Reliability Calculator-获取适合/ MTBF数据以进行各种操作条件
CSP 1508 4-Pins3D Step Model- 预览3D中的振荡器包