WLCSP.包裹均匀材料和SGS Report

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均匀材料和SGS Report
WLCSP.包裹
DOC: QI-81 Rev: A01
修订记录
Rev.
改变描述
造成改变的原因
A00
A01
Initial Release
WLCSP均质材料和SGS
报告文件为客户发布
Edited sec 3.2 and Table-1.
由Subcon编辑的MCD表。
CONFIDENTIAL – This document contains proprietary information of SiTime and is tendered subject to the
conditions that the 信息重刑 (A) be retained in 信心, (B) 不是 be reproduced in whole 或者 part, (C)
不是 用过的 或者incorporated in 任何product, 除了下面 an 表达书面 agreement with sit.
仅在invime文档管理系统中查看时仅控制文档,并且应该是
verified for correct revision if viewed/used outside of that system.
Page 1 of 5
均匀材料和SGS Report
WLCSP.包裹
DOC: QI-81 Rev: A01
目录
修订记录.......................................................................................................................... 1
1
3
4
.0
.0
.0
Purpose and Scope......................................................................................................... 3.
信息 ...................................................................................................................... 3.
均匀材料含量表....................................................................4……
CONFIDENTIAL – This document contains proprietary information of SiTime and is tendered subject to the
conditions that the 信息重刑 (A) be retained in 信心, (B) 不是 be reproduced in whole 或者 part, (C)
不是 用过的 或者incorporated in 任何product, 除了下面 an 表达书面 agreement with sit.
仅在invime文档管理系统中查看时仅控制文档,并且应该是
verified for correct revision if viewed/used outside of that system.
第2页,共5页
均匀材料和SGS Report
WLCSP.包裹
DOC: QI-81 Rev: A01
1.0目的 范围
1
.1
目的: list homogeneous materials 用过的 in SiTime WLCSP 包裹
documentation of SGS report availability
1
.2
范围:所有 products manufactured for sit in WLCSP. 包裹
2.0 Reference Documents
2
.1
由均质材料供应商提供的SGS / ICP分析报告/
装配子
2
.2
内部参考文献
2
.2.1 qi-1 锡特米e 绿色伴侣 RoHS/Green 遵守
.2.2 qi-82 WLCSP. Composition Report
2
3.0信息
3
.1
The list of homogeneous materials contained in WLCSP package is given in
表格1和表2.
3
.2
The SGS/ICP analysis reports for the homogeneous materials are received from
the supplier (updated every year) and reviewed and maintained at SiTime.
3
.3 Actual 年代GS reports 能够 be obtained sit sales 必威体育官网手机登录 by 要求。
联系Silime销售支持必威体育官网手机登录 salessupport@sitime.com.
3
.4
As per industry standard practice (JEDEC Standard JESD46), the customer
当材料组成的任何主要变化是时,将完成通知
implemented which affects form, fit and function. No annual updating will be done
CONFIDENTIAL – This document contains proprietary information of SiTime and is tendered subject to the
conditions that the 信息重刑 (A) be retained in 信心, (B) 不是 be reproduced in whole 或者 part, (C)
不是 用过的 或者incorporated in 任何product, 除了下面 an 表达书面 agreement with sit.
仅在invime文档管理系统中查看时仅控制文档,并且应该是
verified for correct revision if viewed/used outside of that system.
第3页,共5页
均匀材料和SGS Report
WLCSP.包裹
DOC: QI-81 Rev: A01
到这份文件。对此文档的更新(以及更新SGS报告)
will be done only when,
3
3
.4.1There is 任何 change in the 纲l contents the 包裹或 homogeneous
l
.4.2 监管变化 听写 that new analysis be 做了T.o the homogeneous
符合规定的材料
4.0同质 Material 内容 桌子
4
.1同质化 Material List for WLCSP. 包裹- ASE: 表格1 表2
WLCSP Harrison Package-ASE中包含的表1个均质材料清单
胎生素eous
Material
CMOS Die
物质名称/型号
年代ilicon
年代upplier
TSMC
SGS报告
Back-side coating
聚合物1/2(CMOS)
UBM(CMOS)
LC2850.
LINTEC公司
PBO-HD8820
Ti/NiV/Cu
Hitachi Chemicals DuPont Microsystems
Umicore Thin Film Products
u
焊球(CMOS)
MEMS DIE.
Snagcu.405
年代ilicon
BOSC.H
Polymer 1 (MEMS)
Die Attach Underfill
UBM(MEMS)
Polyimide HD-4000
UH-0.5
Hitachi Chemicals Dupont Microsystems
日立化学公司
Umicore Thin Film Products
三菱材料公司
Ti/NiV/Cu
焊料凹凸(MEMS)
Snagcu.405
CONFIDENTIAL – This document contains proprietary information of SiTime and is tendered subject to the
conditions that the 信息重刑 (A) be retained in 信心, (B) 不是 be reproduced in whole 或者 part, (C)
不是 用过的 或者incorporated in 任何product, 除了下面 an 表达书面 agreement with sit.
仅在invime文档管理系统中查看时仅控制文档,并且应该是
verified for correct revision if viewed/used outside of that system.
Page 4 of 5
均匀材料和SGS Report
WLCSP.包裹
DOC: QI-81 Rev: A01
表格1胎生素eous Material List Contained in WLCSP Galileo/Northstar
包裹-
胎生素eous
Material
CMOS Die
物质名称/型号
年代ilicon
年代upplier
TSMC
SGS报告
Back-side coating
聚合物1/2(CMOS)
RDL (CMOS)
LC2850.
LINTEC公司
PBO-HD8820
Ti / al.
Hitachi Chemicals DuPont Microsystems
Umicore Thin Film Products
Umicore Thin Film Products
u
UBM(CMOS)
Al/NiV/Cu
Snagcu.405
年代ilicon
焊球(CMOS)
MEMS DIE.
BOSC.H
Polymer 1 (MEMS)
Die Attach Underfill
UBM(MEMS)
Polyimide HD-4000
UH-0.5
Hitachi Chemicals Dupont Microsystems
日立化学公司
Umicore Thin Film Products
三菱材料公司
Ti/NiV/Cu
焊料凹凸(MEMS)
Snagcu.405
CONFIDENTIAL – This document contains proprietary information of SiTime and is tendered subject to the
conditions that the 信息重刑 (A) be retained in 信心, (B) 不是 be reproduced in whole 或者 part, (C)
不是 用过的 或者incorporated in 任何product, 除了下面 an 表达书面 agreement with sit.
仅在invime文档管理系统中查看时仅控制文档,并且应该是
verified for correct revision if viewed/used outside of that system.
Page 5 of 5