均匀材料和SGS Report
WLCSP.包裹
DOC:
QI-81
Rev:
A01
修订记录
Rev.
改变描述
造成改变的原因
A00
A01
Initial Release
WLCSP均质材料和SGS
报告文件为客户发布
Edited sec 3.2 and Table-1.
由Subcon编辑的MCD表。
CONFIDENTIAL – This document contains proprietary information of SiTime and is tendered subject to the
conditions that
the
信息重刑
(A)
be
retained in
信心,
(B)
不是
be
reproduced
in whole
或者
part,
和
(C)
不是
用过的
或者incorporated
in
任何product,
除了下面
an
表达书面
agreement
with
sit.
这
仅在invime文档管理系统中查看时仅控制文档,并且应该是
verified for correct revision if viewed/used outside of that system.
Page 1 of 5
均匀材料和SGS Report
WLCSP.包裹
DOC:
QI-81
Rev:
A01
目录
修订记录.......................................................................................................................... 1
1
3
4
.0
.0
.0
Purpose and Scope......................................................................................................... 3.
信息 ...................................................................................................................... 3.
均匀材料含量表....................................................................4……
CONFIDENTIAL – This document contains proprietary information of SiTime and is tendered subject to the
conditions that
the
信息重刑
(A)
be
retained in
信心,
(B)
不是
be
reproduced
in whole
或者
part,
和
(C)
不是
用过的
或者incorporated
in
任何product,
除了下面
an
表达书面
agreement
with
sit.
这
仅在invime文档管理系统中查看时仅控制文档,并且应该是
verified for correct revision if viewed/used outside of that system.
第2页,共5页
均匀材料和SGS Report
WLCSP.包裹
DOC:
QI-81
Rev:
A01
1.0目的
和
范围
1
.1
目的:
list
homogeneous materials
用过的
in SiTime WLCSP
包裹
和
documentation of SGS report availability
1
.2
范围:所有
products
manufactured
for
sit
in
WLCSP.
包裹
2.0 Reference
Documents
2
.1
由均质材料供应商提供的SGS / ICP分析报告/
装配子
2
.2
内部参考文献
2
.2.1 qi-1
锡特米e
绿色伴侣
和
RoHS/Green
遵守
.2.2 qi-82
WLCSP.
Composition
Report
2
3.0信息
3
.1
The list of homogeneous materials contained in WLCSP package is given in
表格1和表2.
3
.2
The SGS/ICP analysis reports for the homogeneous materials are received from
the supplier (updated every year) and reviewed and maintained at SiTime.
3
.3
Actual
年代GS
reports
能够
be obtained
从
sit
sales
必威体育官网手机登录
by
要求。
联系Silime销售支持必威体育官网手机登录
salessupport@sitime.com.
3
.4
As per industry standard practice (JEDEC Standard JESD46), the customer
当材料组成的任何主要变化是时,将完成通知
implemented which affects form, fit and function. No annual updating will be done
CONFIDENTIAL – This document contains proprietary information of SiTime and is tendered subject to the
conditions that
the
信息重刑
(A)
be
retained in
信心,
(B)
不是
be
reproduced
in whole
或者
part,
和
(C)
不是
用过的
或者incorporated
in
任何product,
除了下面
an
表达书面
agreement
with
sit.
这
仅在invime文档管理系统中查看时仅控制文档,并且应该是
verified for correct revision if viewed/used outside of that system.
第3页,共5页
均匀材料和SGS Report
WLCSP.包裹
DOC:
QI-81
Rev:
A01
到这份文件。对此文档的更新(以及更新SGS报告)
will be done only when,
3
3
.4.1There
is
任何
change
in
the
纲l
contents
的
the
包裹或
homogeneous
纲l
.4.2
监管变化
听写
that new
analysis
be
做了T.o
the
homogeneous
符合规定的材料
4.0同质
Material
内容
桌子
4
.1同质化
Material
List
for
WLCSP.
包裹-
ASE:
表格1
和
表2
WLCSP Harrison Package-ASE中包含的表1个均质材料清单
胎生素eous
Material
CMOS Die
物质名称/型号
年代ilicon
年代upplier
TSMC
SGS报告
√
√
√
√
√
√
√
√
√
√
Back-side coating
聚合物1/2(CMOS)
UBM(CMOS)
LC2850.
LINTEC公司
PBO-HD8820
Ti/NiV/Cu
Hitachi Chemicals DuPont Microsystems
Umicore Thin Film Products
森u
焊球(CMOS)
MEMS DIE.
Snagcu.405
年代ilicon
BOSC.H
Polymer 1 (MEMS)
Die Attach Underfill
UBM(MEMS)
Polyimide HD-4000
UH-0.5
Hitachi Chemicals Dupont Microsystems
日立化学公司
Umicore Thin Film Products
三菱材料公司
Ti/NiV/Cu
焊料凹凸(MEMS)
Snagcu.405
CONFIDENTIAL – This document contains proprietary information of SiTime and is tendered subject to the
conditions that
the
信息重刑
(A)
be
retained in
信心,
(B)
不是
be
reproduced
in whole
或者
part,
和
(C)
不是
用过的
或者incorporated
in
任何product,
除了下面
an
表达书面
agreement
with
sit.
这
仅在invime文档管理系统中查看时仅控制文档,并且应该是
verified for correct revision if viewed/used outside of that system.
Page 4 of 5
均匀材料和SGS Report
WLCSP.包裹
DOC:
QI-81
Rev:
A01
表格1胎生素eous Material List Contained in WLCSP Galileo/Northstar
包裹-
胎生素eous
Material
CMOS Die
物质名称/型号
年代ilicon
年代upplier
TSMC
SGS报告
√
√
√
√
√
√
√
√
√
√
√
Back-side coating
聚合物1/2(CMOS)
RDL (CMOS)
LC2850.
LINTEC公司
PBO-HD8820
Ti / al.
Hitachi Chemicals DuPont Microsystems
Umicore Thin Film Products
Umicore Thin Film Products
森u
UBM(CMOS)
Al/NiV/Cu
Snagcu.405
年代ilicon
焊球(CMOS)
MEMS DIE.
BOSC.H
Polymer 1 (MEMS)
Die Attach Underfill
UBM(MEMS)
Polyimide HD-4000
UH-0.5
Hitachi Chemicals Dupont Microsystems
日立化学公司
Umicore Thin Film Products
三菱材料公司
Ti/NiV/Cu
焊料凹凸(MEMS)
Snagcu.405
CONFIDENTIAL – This document contains proprietary information of SiTime and is tendered subject to the
conditions that
the
信息重刑
(A)
be
retained in
信心,
(B)
不是
be
reproduced
in whole
或者
part,
和
(C)
不是
用过的
或者incorporated
in
任何product,
除了下面
an
表达书面
agreement
with
sit.
这
仅在invime文档管理系统中查看时仅控制文档,并且应该是
verified for correct revision if viewed/used outside of that system.
Page 5 of 5